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SiP for Automotive Apps Delivers EMC and ESD Performance

 

04/09/09 12:03 PM

A new system-in-package solution (SiP) for LIN automotive networking applications is now available from Atmel Corporation. The ATA6617 combines a proprietary LIN System Basis Chip (SBC) AT6624 that includes a LIN transceiver, voltage regulator, watchdog, and an AVR microcontroller (ATiny 167 with 16-k flash memory) in a single package. This new Sip is based on Atmel’s second generation LIN IP that is touted as having excellent EMC and ESD performance. It is optimized for low-cost LIN slave applications and allows system cost reductions of up to 25 percent. A LIN UART with integrated hardware routines simplifies protocol stack handling and limits the interrupt generation, thus reducing the microcontroller load and flash memory consumption.

To ensure that the LIN node’s current consumption is below 100 mA in applications that are continuously connected to the battery, the AT6617 provides several current saving modes in which different functionalities are individually switched off or on, depending on application requirements. The device comes in a small QFN38 package measuring 5 x 7 mm. Look for more product information on the Atmel website.


channel guide

MARKETS


Silver ... Aerospace

Silver ... Automotive

Silver ... Military

Silver ... NEBS/Telecom


TECHNOLOGIES


Silver ... Amplifiers

Silver ... Antennas

Silver ... Connectors

Silver ... Ferrites

Silver ... Filters

Silver ... Shielding

Silver ... Testing

 

 

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